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USB Flash Drive PCB Boards, PCB Boards for USB Flash Drives

USB Flash Drive PCB Boards, PCB Boards for USB Flash Drives

Payment Terms : T/T, Western Union
Trade Terms : FOB
Production Capacity : 10000PCS/Day
Storage Capacity : Custom-Made
Min. order : 100 Pieces
Interface Type : USB 2.0
Main Markets : Global
Place of Origin : china
Category : Double-Sided PCB
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PCB board
Custom Logo Available
USB 2.0 Compatible
RoHS passed
Interface: USB 2.0 / 1.1
Dimen.: PCB + USB 40.4*13.9*0.8mm
PCB 38.4*13.9*0.8mm
Weight: 10g
Data Retention: 10 years
Durability: 1, 000, 000 read write cycle
Capacity: 128MB/256MB/512MB/1GB/2GB/4G/8GB/16GB/32GB
Feature:
*USB 2.0 compatible, true Plug and Play.
*Powered directly via the USB port.
No external Power or battery needed
*LED Indicates the usage status of the Flash Disk
*Light Weight and compact Size
System Requirement
*Hardware: Desktop or notebook computer with USB port
*Operating System: Windows XP / 2000 / ME / Vista or later
MAC OS X, Linux Kernel 2.4.1 or later.
PCB Production Capability:
Files Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant), FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
Layer No. 1 - 12 Layers
Board thickness 0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance ± 10%
Copper thickness 0.5OZ - 4OZ
Impedance Control ± 10%
Warpage 0.075%-1.5%
Peelable 0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a) 0.004"(0.1mm)
Min Space Width (b) 0.004"(0.1mm)
Min Annular Ring 0.004"(0.1mm)
SMD Pitch (a) 0.012"(0.3mm)
PCB with green solder mask and LF-FREE surface finishing BGA Pitch (b) 0.027"(0.675mm)
Regesiter torlerance 0.05mm
Min Solder Mask Dam (a) 0.005"(0.125mm)
Soldermask Clearance (b) 0.005"(0.125mm)
Min SMT Pad spacing (c) 0.004"(0.1mm)
Solder Mask Thickness 0.0007"(0.018mm)
Hole size 0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-) ± 0.003"(± 0.0762mm)
Aspect Ratio 10: 01
Hole Registration 0.003"(0.075mm)
HASL 2.5um
Lead free HASL 2.5um
Immersion Gold Nickel 3-7um Au: 1-3u''
OSP 0.2-0.5um
Panel Outline Tol (+/-) ± 0.004''(± 0.1mm)
Beveling 30° 45°
V-cut 15° 30° 45° 60°
Surface finish HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate RoHS ISO9001 TS16949 SGS UL
Special requirements Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger&

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